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The growing demand for silicon capacitors also aligns with Samsung Electro-Mechanics’ announcement on May 20. Chosun Biz, citing a press release, reported that the firm has secured a silicon capacitor supply deal worth roughly 1.557 trillion won (USD 993million) with a major global customer, covering the period from January next year (January 2027) through December 2028.
Meanwhile, they are also built on a silicon wafer-based ultra-thin structure, enabling higher-density integration, the report suggests.
Citing an industry source, the report adds that voltage droop in high-frequency AI workloads is difficult to fully address with MLCCs alone, which is why Intel is increasingly turning to silicon capacitors as a potential solution.
ZDNet further explains that a capacitor is a key circuit component that stores and releases electrical energy. Silicon capacitors, in particular, offer ultra-low equivalent series inductance (ESL) and equivalent series resistance (ESR)—reportedly more than 100 times lower than traditional multilayer ceramic capacitors (MLCCs)—helping significantly reduce signal loss in high-performance semiconductors.
ZDNet notes that while EMIB is widely seen as a more cost-efficient advanced packaging solution, it is increasingly encountering limitations in providing stable power delivery for AI chips with rapidly rising power demands. To address this challenge, silicon capacitors and through-silicon vias (TSVs) are expected to be introduced for Google’s v8e, according to the report.
Intel Reported to Adopt Silicon Capacitors in 2027 to Improve EMIB Power Stability for Google’s v8e
Date: 28 May 2026
With TSMC’s CoWoS capacity remaining constrained, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology is increasingly gaining traction as an alternative, fueling expectations for stronger demand across related components.
Notably, ZDNet reports that Intel plans to begin mass adoption of silicon capacitors in 2027 to strengthen EMIB performance.
Samsung Electro-Mechanics wins $993 mil AI chip part deal in US
Published May 20, 2026 3:59 PM KST
Samsung Electro-Mechanics said Wednesday it has signed a 1.5 trillion-won ($993 million) deal to supply silicon capacitors, key components used in advanced semiconductor packages and chips, to a major technology company in the United States.
