MATERIAL LITIGATION HEITECH PADU BERHAD BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") SHAH ALAM HIGH COURT SUIT NO: BA-22NCVC-36-02/2026 KAYANGAN CAHAYA SDN BHD (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT)
| HEITECH PADU BERHAD |
| Type | Announcement |
| Subject | MATERIAL LITIGATION |
| Description | HEITECH PADU BERHAD BERHAD [199401024950 (310628-D)] ("HEITECH" OR "THE COMPANY") SHAH ALAM HIGH COURT SUIT NO: BA-22NCVC-36-02/2026 KAYANGAN CAHAYA SDN BHD (PLAINTIFF) VS HEITECH PADU BERHAD (DEFENDANT) |
|
The Board of Directors of HeiTech wishes to announce that the Company, had on 12 February 2026 received a Writ of Summons and Statement of Claim, filed by Kayangan Cahaya Sdn Bhd (“Plaintiff”) in Shah Alam High Court.
The Plaintiff is claiming a sum of approximately RM5,077,756.97 in respect of the “Perjanjian Perkhidmatan Penyelenggaraan Bangunan” dated 05 April 2024 (“BMSA 2024”) and associated works.
The Company has duly filed its Memorandum of Appearance.
The Company disputes the claim and is in the process of reviewing the allegations with its solicitors. The Company intends to defend the suit.
At this juncture, the Board is unable to reliably ascertain the financial impact of the suit pending the filing of the defence and further developments in the proceedings. No provision has been made at this stage, pending legal assessment.
The Company will make further announcements as and when there are material developments in the above matter.
This announcement is dated 16 February 2026. |
|
Announcement Info
| Company Name | HEITECH PADU BERHAD |
| Stock Name | HTPADU |
| Date Announced | 16 Feb 2026 |
| Category | General Announcement for PLC |
| Reference Number | GA1-16022026-00060 |