OPPSTAR
0275 S0.655 ↓
| High | 0.680 |
| Low | 0.650 |
| Open | 0.670 |
| Volume | 15,387,800 |
| Volume (B/S) | 94,700 / 85,000 |
| Price Bid/Ask | 0.655 / 0.660 |
| 52w | 0.175 - 1.060 |
| ROE | -13.11 |
| P/E | -26.29 |
| EPS | -2.49 |
| DPS | |
| DY | 0.00% |
| NTA | 0.1900 |
| P/B | 3.45 |
| RPS | 5.37 |
| PSR | 12.20 |
| Market Cap | 421.5M |
| Shares (mil) | 643.46 |
| QoQ |
| CAGR % |
3Y
34.4%
TTM
-53.4%
5Y
-52.8%
TTM
32.5%
|
| RSI(14) | Neutral 58.0 |
| Stochastic(14) | Neutral 42.1 |
| Stochastic RSI(14) | Oversold 2.2 Buy |
| Average Volume (3M) | 2,068,400 |
| Relative Volume | 1.3 |
| Announced | Financial Year | Subject | EX Date | Payment Date | Amount | Indicator | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| 31 Mar, 2024 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 30 May 2024 | 31 Mar 2024 | Second Interim Dividend | 14 Jun 2024 | 03 Jul 2024 | 0.0030 | Currency | View | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 26 Feb 2024 | 31 Mar 2024 | First Interim Dividend | 15 Mar 2024 | 03 Apr 2024 | 0.0050 | Currency | View | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 31 Mar, 2023 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 29 May 2023 | 31 Mar 2023 | First Interim Dividend | 16 Jun 2023 | 05 Jul 2023 | 0.0080 | Currency | View | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Announced | EX Date | Subject | Ratio | Offer |
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No records
| Name | Price | Change | Volume | Gearing | Premium | Premium % | Maturity |
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No warrants found.
Recent News
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Cover Story: SkyeChip positions for AI supercycle
EVERY major computing wave over the last few decades has given birth to a new generation of semiconductor giants. The personal computer and internet age was underpinned by the rise of Intel Corp, followed by the advent of smartphones that propelled the likes of US-based Broadcom Inc and Qualcomm Inc and Taiwan-based MediaTek Inc into fabless chip powerhouses.TheEdge -
Cover Story: Within Arm’s reach
MALAYSIA’S ambition to move up the semiconductor value chain received another boost on May 11, when local chip design firms SkyeChip Bhd (KL:SKYECHIP), Oppstar Bhd (KL:OPPSTAR) and GreatAsic Technology Sdn Bhd formally received offer letters from the government granting them access to Arm Holding...TheEdge -
Bursa Malaysia rendah susulan peningkatan risiko geopolitik
KUALA LUMPUR: Bursa Malaysia ditutup rendah pada Selasa apabila pelabur melakukan penjualan bagi merealisasikan keuntungan daripada pegangan ekoran ketegangan Amerika Syarikat (AS) dan Iran yang memuncak.BeritaHarian -
Trading ideas: Exsim Hospitality, IJM Land, Gamuda, Oppstar, PMW, Censof, MyEG, TNB, Axiata, MISC, Sime Darby, MBMR, TMK, Lianson, BIMB, Cahya Mata
KUALA LUMPUR: Here is a recap of the announcements that made headlines in Corporate Malaysia.TheStar -
Oppstar wins AI chip contract
PETALING JAYA: Semiconductor firm Oppstar Bhd has entered into a design service agreement with a technology venture based in Yokohama, Japan, to design and develop a reconfigurable artificial intelligence (AI) chip solution for a fee of RM11.5mil.TheStar
Recent Announcements
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MEMORANDUM OF UNDERSTANDING
QUARTERLY UPDATE ON THE STATUS OF MEMORANDUMS OF UNDERSTANDING ENTERED WITH INVENTEC CORPORATION ("INVENTEC") AND ASICAI CO., LTD. ("ASICAI") -
Quarterly rpt on consolidated results for the financial period ended 31/03/2026
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OTHERS
EXECUTION OF AN ACCESS TOKEN AGREEMENT WITH THE MALAYSIAN INVESTMENT DEVELOPMENT AUTHORITY ("MIDA") BY OPPSTAR TECHNOLOGY SDN BHD ("OPPSTAR TECHNOLOGY"), A WHOLLY-OWNED SUBSIDIARY OF OPPSTAR ("AGREEMENT ") -
OTHERS
EXECUTION OF A DESIGN SERVICE AGREEMENT FOR THE DESIGN AND DEVELOPMENT OF A RECONFIGURABLE ARTIFICIAL INTELLIGENCE ("AI") CHIP SOLUTION BETWEEN A TECHNOLOGY COMPANY BASED IN YOKOHAMA, JAPAN ("CLIENT") AND OPPSTAR MICROELECTRONICS SDN BHD ("OPPSTAR MICROELECTRONICS") -
OTHERS
MUTUAL TERMINATION OF A STATEMENT OF WORK FOR THE DESIGN AND DEVELOPMENT OF A RECONFIGURABLE ARTIFICIAL INTELLIGENCE ("AI") CHIP SOLUTION BETWEEN A TECHNOLOGY COMPANY BASED IN YOKOHAMA, JAPAN ("CLIENT"), OPPSTAR MICROELECTRONICS SDN BHD ("OPPSTAR MICROELECTRONICS") AND SILICON X SDN BHD ("SILICON X")