SUNVIEW

0.365

(%)

NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING SUNVIEW GROUP BERHAD ("SUNVIEW" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SUNVIEW (EXCLUDING TREASURY SHARES, IF ANY) ("PRIVATE PLACEMENT")

SUNVIEW GROUP BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description 
SUNVIEW GROUP BERHAD ("SUNVIEW" OR THE "COMPANY")

PRIVATE PLACEMENT OF UP TO 10% OF THE TOTAL NUMBER OF ISSUED SHARES OF SUNVIEW (EXCLUDING TREASURY SHARES, IF ANY) ("PRIVATE PLACEMENT")

We refer to the announcements dated 14 January 2026, 15 January 2026, 22 January 2026, 28 January 2026, 18 March 2026, 30 March 2026 and 31 March 2026 in relation to the Private Placement ("Announcements"). Unless otherwise defined, the definitions set out in the Announcements shall apply herein.

 

On behalf of the Board, Kenanga IB wishes to announce that the Board had on 30 April 2026 resolved to fix the issue price for the second tranche of the Placement Shares at RM0.3269 per Placement Share ("Issue Price").

 

The Issue Price of RM0.3269 represents a discount of RM0.0363 or approximately 9.99% to the 5-day VWAMP of Sunview Shares up to and including 29 April 2026, being the last trading day immediately before the price-fixing date of RM0.3632.

 

This announcement is dated 30 April 2026.



Announcement Info

Company Name SUNVIEW GROUP BERHAD
Stock Name SUNVIEW
Date Announced 30 Apr 2026
Category General Announcement for PLC
Reference Number GA1-30042026-00050


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