HONGSENG

0.010

(%)

NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HONG SENG CONSOLIDATED BERHAD ("HONG SENG" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10% OF THE EXISTING TOTAL NUMBER OF ISSUED SHARES IN HONG SENG (EXCLUDING TREASURY SHARES, IF ANY) PURSUANT TO SECTIONS 75 AND 76 OF THE COMPANIES ACT 2016 ("PRIVATE PLACEMENT")

HONG SENG CONSOLIDATED BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description 
HONG SENG CONSOLIDATED BERHAD ("HONG SENG" OR THE "COMPANY")

PRIVATE PLACEMENT OF UP TO 10% OF THE EXISTING TOTAL NUMBER OF ISSUED SHARES IN HONG SENG (EXCLUDING TREASURY SHARES, IF ANY) PURSUANT TO SECTIONS 75 AND 76 OF THE COMPANIES ACT 2016 ("PRIVATE PLACEMENT")

 

We refer to the announcements dated 17 October 2024, 22 October 2024, 9 January 2025, 19 February 2025, 30 July 2025 and 7 August 2025 in relation to the Private Placement ("Announcements"). Unless otherwise defined, the definitions set out in the Announcements shall apply herein.


On behalf of the Board, TA Securities wishes to announce that the Board has on 21 January 2026 ("Price-fixing Date"), resolved to fix the issue price at RM0.0047 per Placement Share ("Issue Price").


The Issue Price represents a discount of RM0.0005 or approximately 9.62% to the 5D-VWAP of Hong Seng Share up to and including 20 January 2026, being the last market day immediately preceding the Price-fixing Date, of RM0.0052 per Hong Seng Share.

 

This announcement is dated 21 January 2026.



Announcement Info

Company Name HONG SENG CONSOLIDATED BERHAD
Stock Name HONGSENG
Date Announced 21 Jan 2026
Category General Announcement for PLC
Reference Number GA1-21012026-00033


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