OTHERS WAWASAN DENGKIL HOLDINGS BERHAD ("WAWASAN" OR "THE COMPANY") - JOINT VENTURE AGREEMENT ENTERED BETWEEN WAWASAN DENGKIL SDN. BHD., A WHOLLY-OWNED SUBSIDIARY OF THE COMPANY AND TWIN HI-TECHNOLOGIES SDN. BHD.
| WAWASAN DENGKIL HOLDINGS BERHAD |
| Type | Announcement |
| Subject | OTHERS |
| Description | WAWASAN DENGKIL HOLDINGS BERHAD ("WAWASAN" OR "THE COMPANY") - JOINT VENTURE AGREEMENT ENTERED BETWEEN WAWASAN DENGKIL SDN. BHD., A WHOLLY-OWNED SUBSIDIARY OF THE COMPANY AND TWIN HI-TECHNOLOGIES SDN. BHD. |
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Unless otherwise defined in this announcement, all terms used herein shall have the same meaning as those defined in the announcements dated 2 July 2025 and 5 August 2025.
The Board of Directors of Wawasan (“the Board”) wishes to provide additional information pursuant to the announcements made on 2 July 2025 and 6 August 2025 in regards to the Joint Venture Agreement (“JVA”) entered between Wawasan Dengkil Sdn. Bhd. (“WDSB”), a wholly-owned subsidiary of the Company with Twin Hi-Technologies Sdn. Bhd. (“THSB”) to undertake the procurement, construction and commissioning of fiber optic infrastructure for Southern Region of Peninsular Malaysia (“Silica Project”), pertain to the LOA awarded by PG Linkaranfibre Sdn. Bhd. which announced on 2 July 2025.
Please refer to the attachment for the additional information of the JVA.
This announcement is dated 7 August 2025. |
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Please refer attachment below.
Announcement Info
| Company Name | WAWASAN DENGKIL HOLDINGS BERHAD |
| Stock Name | DENGKIL |
| Date Announced | 07 Aug 2025 |
| Category | General Announcement for PLC |
| Reference Number | GA1-07082025-00015 |